“Improved Method to Reduce Interfacial Defects in Bonding Polydimethylsiloxane Layers of Microfluidic Devices for lab–on–chip Applications”. Superficies Y Vacío, vol. 30, no. 2, June 2017, pp. 25-29, https://doi.org/10.47566/2017_syv30_1-020025.