Improved method to reduce interfacial defects in bonding polydimethylsiloxane layers of microfluidic devices for lab–on–chip applications. Superficies y Vacío, [S. l.], v. 30, n. 2, p. 25–29, 2017. DOI: 10.47566/2017_syv30_1-020025. Disponível em: https://superficiesyvacio.smctsm.org.mx/index.php/SyV/article/view/2017_syv30_1-020025. Acesso em: 4 apr. 2025.